A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.

Winston S. Shue Y. H. Lin Chang-Chun Lee C. Y. Liao M. H. Lin W. C. Tu Robin Chen H. P. Chen Winston S. Shue Min Cao A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. 1-4 2023 IRPS https://doi.org/10.1109/IRPS48203.2023.10117795 conf/irps/2023 db/conf/irps/irps2023.html#LinLLLTCCSC23 Min Cao H. P. Chen Robin Chen Chang-Chun Lee C. Y. Liao M. H. Lin Y. H. Lin W. C. Tu