imec

𝗜𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻 𝗱𝗼𝗲𝘀𝗻'𝘁 𝗵𝗮𝗽𝗽𝗲𝗻 𝗶𝗻 𝗶𝘀𝗼𝗹𝗮𝘁𝗶𝗼𝗻. 𝗜𝘁 𝗵𝗮𝗽𝗽𝗲𝗻𝘀 𝘄𝗵𝗲𝗻 𝗲𝘅𝗽𝗲𝗿𝘁𝗶𝘀𝗲, 𝗶𝗻𝗳𝗿𝗮𝘀𝘁𝗿𝘂𝗰𝘁𝘂𝗿𝗲 𝗮𝗻𝗱 𝗰𝗼𝗹𝗹𝗮𝗯𝗼𝗿𝗮𝘁𝗶𝗼𝗻 𝗰𝗼𝗺𝗲 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿 𝘁𝗼 𝘀𝗼𝗹𝘃𝗲 𝘀𝗵𝗮𝗿𝗲𝗱 𝗰𝗵𝗮𝗹𝗹𝗲𝗻𝗴𝗲𝘀.   Earlier this month, CHIP CONNECT BW officially kicked off in Baden-Württemberg, bringing together research organizations, industry and the public sector to strengthen the region's semiconductor ecosystem. As one of the initiative's key partners, imec Germany contributes its expertise in chiplet-based architectures, design and validation. Together, the partners are working to accelerate innovation in strategic domains including physical AI, #chiplets for the #autonomous edge and sustainable mobility, helping move promising research closer to industrial applications.   By connecting expertise across academia, research, industry and government, CHIP CONNECT BW aims to strengthen regional collaboration, support Europe's semiconductor value chain and reinforce the competitiveness of one of Europe's leading innovation regions.   Thank you to CHIP CONNECT BW, imec Germany, e-mobil BW GmbH, IPAI, Fraunhofer IAF, microTEC Südwest e.V., Ministerium für Wirtschaft, Handwerk und Tourismus Baden-Württemberg, all speakers and participants for making the kick-off a success.    We look forward to the collaborations and innovations this initiative will enable. 📸 © Laura Boysen

What happens when brain-computer interfaces evolve from hundreds to thousands of recording channels?   A newly awarded European Research Council (ERC) Proof of Concept grant will support AIM-HIGH, a research project that builds on imec's latest work in neural telemetry.   Brain-computer interfaces (BCIs) are advancing rapidly, but scaling them comes with a major challenge: managing the enormous volumes of neural data generated while keeping power consumption and heat generation under control.   Researchers at imec the Netherlands have developed a neuromorphic compressive telemetry (NCT) chip that reduces neural data volumes by more than 10x while preserving signal fidelity. This breakthrough lays the foundation for future high-density BCIs capable of recording neural activity at unprecedented scale. Read the full article on the website: https://lnkd.in/enTFUjg3

How do we keep AI on a sustainable and scalable growth path? As AI workloads continue to grow, the industry faces a difficult challenge: translating technology advances into systems that can deliver meaningful gains in performance, power efficiency, and manufacturability at scale. At ITF Taiwan, experts from across the semiconductor ecosystem will discuss some of the key technologies driving that transition, including High-NA EUV, CMOS 2.0, heterogeneous integration, integrated photonics for AI infrastructure, advanced memory technologies, and 3D integration. The program features perspectives from K.C. Hsu (TSMC), Teng Chow Ooi (FusionAP), James Palles-Dimmock (Quantum Motion), and Patrick Vandenameele (imec), alongside leaders from across the broader semiconductor value chain. Read more: https://lnkd.in/eyzXgFzv

AI is changing how new semiconductor materials are discovered and developed. CuspAI, together with NVIDIA, Meta, Samsung Electronics, Applied Materials, Lam Research, Tokyo Electron and imec, has launched the AI Materials Foundry. As one of the 48 founding members, imec is joining a global network that combines high-quality data, world-class laboratories, advanced compute infrastructure and scientific expertise to accelerate the discovery and development of new materials. The AI Materials Foundry provides the production infrastructure for industrial materials discovery, enabling partners to run full discovery cycles from AI-driven materials design and simulation to synthesis planning and experimental validation. For the semiconductor industry, identifying, testing and validating new materials remains a major bottleneck for future advances in logic, memory, packaging and energy-efficient computing. imec will contribute its expertise in materials research and AI, together with its experimental infrastructure and compute know-how, to help accelerate the transition from digital materials discovery to validated physical results.

"𝗬𝗼𝘂 𝗮𝗿𝗲 𝗺𝗼𝗿𝗲 𝘁𝗵𝗮𝗻 𝗷𝘂𝘀𝘁 𝗮 𝗹𝗮𝗯𝗲𝗹." Growing up in India, Darayus Adil Patel learned an important lesson: we are not defined by the labels others place on us. Looking back, there's one piece of advice he'd share with his younger self: first look within. And whatever answer you find, pursue it with passion. Today, he works alongside colleagues from more than 100 nationalities. For him, that's one of the most rewarding aspects of working at imec. Because the best ideas don't emerge in silos. They emerge when diverse perspectives, experiences and ambitions come together. And that's what excites him most: not just imagining the future, but helping create it every day. 🎥 Meet Darayus and hear the advice he'd share with his younger self. #futureatimec

Press release - Imec and Diraq have demonstrated the coherent operation and readout of an eight-silicon-MOS spin-qubit array designed and fabricated on imec's advanced 300mm CMOS-compatible manufacturing platform.   The results show that industrial semiconductor manufacturing can support quantum processors beyond individual and two-qubit devices, bringing the industry closer to large-scale, manufacturable quantum computing.   Read the full press release: https://lnkd.in/eAJeZRtq

𝗔𝗜 𝘀𝗰𝗮𝗹𝗶𝗻𝗴 𝗻𝗲𝗲𝗱𝘀 𝗮 𝗻𝗲𝘄 𝗽𝗹𝗮𝘆𝗯𝗼𝗼𝗸. As AI workloads continue to grow in scale and complexity, the next leap in compute efficiency won't come from transistor scaling alone. It will require innovation across the entire compute stack, from algorithms and architectures to devices, packaging and system integration. That's the premise of a recent Semiconductor Engineering article featuring insights from imec. It explores why the future of AI scaling depends on a holistic approach, a vision that closely aligns with imec's Cross Technology Co Optimization (XTCO) program to help unlock the next generation of energy efficient AI systems. No single breakthrough will define the next era of AI. Progress will come from connecting innovations across disciplines and technologies. Read the article to explore why creating a Moore's Law for AI calls for a fundamentally new approach to scaling ➡️ https://lnkd.in/gr6xiFd9. #AI #XTCO

𝗔𝘂𝘁𝗼𝗻𝗼𝗺𝗼𝘂𝘀 𝗲𝗱𝗴𝗲 𝗰𝗼𝗺𝗽𝘂𝘁𝗶𝗻𝗴 𝘄𝗶𝗹𝗹 𝗿𝗲𝗾𝘂𝗶𝗿𝗲 𝗮 𝗻𝗲𝘄 𝗹𝗲𝘃𝗲𝗹 𝗼𝗳 𝗰𝗼𝗹𝗹𝗮𝗯𝗼𝗿𝗮𝘁𝗶𝗼𝗻 𝗮𝗰𝗿𝗼𝘀𝘀 𝘁𝗵𝗲 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗲𝗰𝗼𝘀𝘆𝘀𝘁𝗲𝗺.   That's why we're proud to have industry leaders such as Rivian actively contributing to imec's Autonomous Edge Chiplet Program (AECP).   In this testimonial, Vidya Rajagopalan shares why Rivian joined the program, how collaborative R&D helps shape their roadmap, and why an open ecosystem is essential to accelerate innovation in autonomous edge computing.   🎥 Watch the video to hear Vidya's perspective.   Interested in contributing to the future of autonomous edge computing? Get in touch to explore engagement opportunities within AECP 👉 https://lnkd.in/dg9AVTYn.   #AECP #Chiplets #Automotive 

Behind every milestone in imec's growth is a team turning plans into reality.   In Leuven, construction of imec 6 continues to make steady progress. Once completed, the new facility will expand imec's R&D infrastructure with additional office and laboratory space.   This milestone would not be possible without the expertise, dedication and close collaboration of the project team guiding the development of the building every step of the way.   As imec continues to expand internationally, we are also investing in our home base in Leuven, strengthening the infrastructure that supports our researchers, employees and future growth.   A big thank you to everyone contributing to this important project.  

𝗢𝗻𝗲 𝗼𝗳 𝘁𝗵𝗲 𝗺𝗼𝘀𝘁 𝘂𝗻𝗱𝗲𝗿𝗲𝘀𝘁𝗶𝗺𝗮𝘁𝗲𝗱 𝘁𝗵𝗶𝗻𝗴𝘀 𝗶𝗻 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗥&𝗗 𝗶𝘀 𝗸𝗻𝗼𝘄𝗶𝗻𝗴 𝘄𝗵𝗲𝗻 𝘁𝗼 𝘀𝘁𝗼𝗽. In a new episode of the Semiconductor Leadership Podcast, Patrick Vandenameele shares how imec approaches that challenge, from identifying the most promising technology pathways to knowing when it's time to stop pursuing others. The conversation explores Patrick's priorities as CEO, CMOS 2.0, hybrid integration, AI in R&D, photonics, advanced packaging and the collaborative innovation that continues to drive the semiconductor ecosystem forward. 🎙️ Listen to the full conversation and discover what it takes to shape the next era of semiconductor innovation 👉 https://lnkd.in/eJuaM6HE