{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,7]],"date-time":"2025-10-07T14:37:05Z","timestamp":1759847825312,"version":"3.37.3"},"reference-count":33,"publisher":"Wiley","issue":"6","license":[{"start":{"date-parts":[[2014,6,10]],"date-time":"2014-06-10T00:00:00Z","timestamp":1402358400000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["71072012"],"award-info":[{"award-number":["71072012"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Quality &amp; Reliability Eng"],"published-print":{"date-parts":[[2014,10]]},"abstract":"<jats:p>In conventional profile monitoring problems, profiles for products or process runs are assumed to have the same length. Statistical monitoring cannot be implemented until a complete profile is obtained. However, in certain cases, a single profile may require several days to generate, so it is important to monitor the profile trajectory to detect unexpected changes during the long processing cycle. Motivated by an ingot growth process in semiconductor manufacturing, we propose a method for monitoring growth profile trajectories of unequal lengths. The profiles are first aligned using the dynamic time warping algorithm and then averaged to generate a baseline. Online monitoring of trajectories is performed based on incomplete growth profiles. Both simulations and an actual application are used to demonstrate the use of the proposed method. Copyright \u00a9 2014 John Wiley &amp; Sons, Ltd.<\/jats:p>","DOI":"10.1002\/qre.1667","type":"journal-article","created":{"date-parts":[[2014,6,10]],"date-time":"2014-06-10T05:36:53Z","timestamp":1402378613000},"page":"815-827","source":"Crossref","is-referenced-by-count":15,"title":["Monitoring Profile Trajectories with Dynamic Time Warping Alignment"],"prefix":"10.1002","volume":"30","author":[{"given":"Chenxu","family":"Dai","sequence":"first","affiliation":[{"name":"Department of Industrial Engineering Tsinghua University  Beijing 100084 China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kaibo","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering Tsinghua University  Beijing 100084 China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ran","family":"Jin","sequence":"additional","affiliation":[{"name":"Grado Department of Industrial and Systems Engineering Virginia Tech  Blacksburg VA 24061 USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2014,6,10]]},"reference":[{"key":"e_1_2_7_2_1","doi-asserted-by":"publisher","DOI":"10.1080\/01621459.2000.10474292"},{"key":"e_1_2_7_3_1","first-page":"759","volume-title":"Introduction to Statistical Quality Control","author":"Montgomery DC","year":"2005"},{"key":"e_1_2_7_4_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2004.11980276"},{"key":"e_1_2_7_5_1","doi-asserted-by":"publisher","DOI":"10.1002\/9781118071984"},{"key":"e_1_2_7_6_1","doi-asserted-by":"publisher","DOI":"10.1002\/qre.711"},{"key":"e_1_2_7_7_1","doi-asserted-by":"publisher","DOI":"10.1002\/qre.858"},{"key":"e_1_2_7_8_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2000.11980027"},{"key":"e_1_2_7_9_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2008.11917709"},{"key":"e_1_2_7_10_1","doi-asserted-by":"publisher","DOI":"10.2307\/2684184"},{"key":"e_1_2_7_11_1","doi-asserted-by":"publisher","DOI":"10.1080\/00401706.1995.10485888"},{"key":"e_1_2_7_12_1","doi-asserted-by":"publisher","DOI":"10.1198\/004017005000000553"},{"key":"e_1_2_7_13_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2002.11980134"},{"key":"e_1_2_7_14_1","doi-asserted-by":"publisher","DOI":"10.1198\/004017008000000433"},{"key":"e_1_2_7_15_1","doi-asserted-by":"publisher","DOI":"10.1198\/TECH.2010.08194"},{"key":"e_1_2_7_16_1","doi-asserted-by":"publisher","DOI":"10.1016\/0952-1976(94)00058-U"},{"key":"e_1_2_7_17_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0952-1976(00)00051-8"},{"key":"e_1_2_7_18_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0098-1354(02)00162-X"},{"key":"e_1_2_7_19_1","doi-asserted-by":"publisher","DOI":"10.1198\/016214503000233"},{"key":"e_1_2_7_20_1","doi-asserted-by":"publisher","DOI":"10.1080\/03610919908813567"},{"key":"e_1_2_7_21_1","doi-asserted-by":"publisher","DOI":"10.1002\/j.1538-7305.1981.tb00272.x"},{"key":"e_1_2_7_22_1","doi-asserted-by":"publisher","DOI":"10.18637\/jss.v031.i07"},{"key":"e_1_2_7_23_1","first-page":"57","volume-title":"Pattern Recognition and Machine Intelligence","author":"Gupta A","year":"2007"},{"key":"e_1_2_7_24_1","doi-asserted-by":"publisher","DOI":"10.1021\/ie101465b"},{"key":"e_1_2_7_25_1","doi-asserted-by":"crossref","first-page":"213","DOI":"10.1080\/00224065.2003.11980209","article-title":"Predicting processes when embedded events occur: dynamic time warping","volume":"35","author":"Nelson BJ","year":"2003","journal-title":"Journal of Quality Technology"},{"key":"e_1_2_7_26_1","doi-asserted-by":"publisher","DOI":"10.1002\/aic.690440412"},{"key":"e_1_2_7_27_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.1991.11979321"},{"key":"e_1_2_7_28_1","doi-asserted-by":"publisher","DOI":"10.1080\/07408179908969913"},{"key":"e_1_2_7_29_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2003.11980233"},{"key":"e_1_2_7_30_1","unstructured":"ZhuL DaiC SunH LiW JinR WangK.Curve monitoring for a single\u2010crystal ingot growth process. Department of Industrial Engineering Tsinghua University 2014. Avaliable athttp:\/\/www.ie.tsinghua.edu.cn\/kbwang\/"},{"key":"e_1_2_7_31_1","doi-asserted-by":"publisher","DOI":"10.1198\/004017003000000023"},{"key":"e_1_2_7_32_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.1993.11979433"},{"key":"e_1_2_7_33_1","doi-asserted-by":"publisher","DOI":"10.1080\/00207540701325488"},{"key":"e_1_2_7_34_1","doi-asserted-by":"publisher","DOI":"10.1080\/00224065.2008.11917716"}],"container-title":["Quality and Reliability Engineering International"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.wiley.com\/onlinelibrary\/tdm\/v1\/articles\/10.1002%2Fqre.1667","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.wiley.com\/onlinelibrary\/tdm\/v1\/articles\/10.1002%2Fqre.1667","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/qre.1667","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,13]],"date-time":"2023-09-13T20:54:32Z","timestamp":1694638472000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1002\/qre.1667"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,6,10]]},"references-count":33,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2014,10]]}},"alternative-id":["10.1002\/qre.1667"],"URL":"https:\/\/doi.org\/10.1002\/qre.1667","archive":["Portico"],"relation":{},"ISSN":["0748-8017","1099-1638"],"issn-type":[{"type":"print","value":"0748-8017"},{"type":"electronic","value":"1099-1638"}],"subject":[],"published":{"date-parts":[[2014,6,10]]}}}