{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,15]],"date-time":"2026-01-15T02:04:18Z","timestamp":1768442658757,"version":"3.49.0"},"reference-count":22,"publisher":"Elsevier BV","issue":"2","license":[{"start":{"date-parts":[[2015,2,1]],"date-time":"2015-02-01T00:00:00Z","timestamp":1422748800000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.elsevier.com\/tdm\/userlicense\/1.0\/"}],"content-domain":{"domain":["elsevier.com","sciencedirect.com"],"crossmark-restriction":true},"short-container-title":["Microelectronics Reliability"],"published-print":{"date-parts":[[2015,2]]},"DOI":"10.1016\/j.microrel.2014.10.007","type":"journal-article","created":{"date-parts":[[2014,12,2]],"date-time":"2014-12-02T21:58:07Z","timestamp":1417557487000},"page":"432-441","update-policy":"https:\/\/doi.org\/10.1016\/elsevier_cm_policy","source":"Crossref","is-referenced-by-count":7,"title":["Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40\u03bcm pitch Cu-pillar\/Sn\u2013Ag bump interconnection"],"prefix":"10.1016","volume":"55","author":[{"given":"Ji-Won","family":"Shin","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Il","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yong-Won","family":"Choi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Young Soon","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Un Byung","family":"Kang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Young Kun","family":"Jee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kyung-Wook","family":"Paik","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"78","reference":[{"key":"10.1016\/j.microrel.2014.10.007_b0005","doi-asserted-by":"crossref","unstructured":"Wang MJ, Hung CY, Kao CL, Lee PN, Chen CH, Hung CP, et al. TSV technology for 2.5D IC solution. In: Proceedings \u2013 electronic components and technology conference; 2012. p. 284\u20138.","DOI":"10.1109\/ECTC.2012.6248842"},{"key":"10.1016\/j.microrel.2014.10.007_b0010","doi-asserted-by":"crossref","first-page":"1832","DOI":"10.1007\/s11664-008-0498-0","article-title":"A study on the thermal reliability of Cu\/SnAg double-bump flip-chip assemblies on organic substrates","volume":"37","author":"Son","year":"2008","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2014.10.007_b0015","doi-asserted-by":"crossref","unstructured":"Dunne R, Takahashi Y, Mawatari K, Matsuura M, Bonifield T, Steinmann P, et al. Development of a stacked WCSP package platform using TSV (through silicon via) technology. In: Proceedings \u2013 electronic components and technology conference; 2012. p. 1062\u20137.","DOI":"10.1109\/ECTC.2012.6248967"},{"key":"10.1016\/j.microrel.2014.10.007_b0020","doi-asserted-by":"crossref","unstructured":"Hwang J, Kim J, Kwon W, Kang U, Cho T, Kang S. Fine pitch chip interconnection technology for 3D integration. In: Proceedings \u2013 electronic components and technology conference; 2010. p. 1399\u2013403.","DOI":"10.1109\/ECTC.2010.5490821"},{"key":"10.1016\/j.microrel.2014.10.007_b0025","doi-asserted-by":"crossref","first-page":"1267","DOI":"10.1016\/S0026-2714(03)00167-7","article-title":"Ultra-high-density interconnection technology of three-dimensional packaging","volume":"43","author":"Takahashi","year":"2003","journal-title":"Microelectron Reliab"},{"key":"10.1016\/j.microrel.2014.10.007_b0030","doi-asserted-by":"crossref","unstructured":"Ebersberger B, Lee C. Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects. In: Proceedings \u2013 electronic components and technology conference; 2008. p. 59\u201366.","DOI":"10.1109\/ECTC.2008.4549951"},{"key":"10.1016\/j.microrel.2014.10.007_b0035","doi-asserted-by":"crossref","first-page":"1336","DOI":"10.1109\/TCPMT.2011.2155655","article-title":"Fabrication of high aspect ratio TSV and assembly with fine-pitch low-cost solder microbump for Si interposer technology with high-density interconnects","volume":"1","author":"Yu","year":"2011","journal-title":"IEEE Trans Comp, Packag Manuf Technol"},{"key":"10.1016\/j.microrel.2014.10.007_b0040","doi-asserted-by":"crossref","unstructured":"Gan H, Wright SL, Polastre R, Buchwalter LP, Horton R, Andry PS, et al. Pb-free micro-joints (50\u03bcm pitch) for the next generation micro-systems: the fabrication, assembly and characterization. In: Proceedings \u2013 electronic components and technology conference; 2006. p. 1210\u20135.","DOI":"10.1109\/ECTC.2006.1645806"},{"key":"10.1016\/j.microrel.2014.10.007_b0045","first-page":"133","article-title":"Underfill flow as viscous flow between parallel plates driven by capillary action, IEEE transactions on components, packaging and manufacturing technology","volume":"19","author":"Schwiebert","year":"1996","journal-title":"Part C. Manuf"},{"key":"10.1016\/j.microrel.2014.10.007_b0050","doi-asserted-by":"crossref","first-page":"517","DOI":"10.1016\/j.microrel.2010.09.031","article-title":"Reliability challenges in 3D IC packaging technology","volume":"51","author":"Tu","year":"2011","journal-title":"Microelectron Reliab"},{"key":"10.1016\/j.microrel.2014.10.007_b0055","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1016\/j.microrel.2012.07.029","article-title":"Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy","volume":"53","author":"Tu","year":"2013","journal-title":"Microelectron Reliab"},{"key":"10.1016\/j.microrel.2014.10.007_b0060","doi-asserted-by":"crossref","unstructured":"Feger C, LaBianca N, Gaynes M, Steen S, Liu Z, Peddi R, et al. The over-bump applied resin wafer-level underfill process: Process, material and reliability. In: Proceedings \u2013 electronic components and technology conference; 2009. p. 1502\u20135.","DOI":"10.1109\/ECTC.2009.5074211"},{"key":"10.1016\/j.microrel.2014.10.007_b0065","doi-asserted-by":"crossref","unstructured":"Honda K, Enomoto T, Nagai A, Takano N. NCF for wafer lamination process in higher density electronic packages. In: Proceedings \u2013 electronic components and technology conference; 2010. p. 1853\u201360.","DOI":"10.1109\/ECTC.2010.5490708"},{"key":"10.1016\/j.microrel.2014.10.007_b0070","unstructured":"Yang TF, Kao KS, Cheng RS, Chang JY, Zhan CJ. Development of wafer-level underfill bonding process for 3D chip stacking. In: Proc IEEE ICEP; 2011. p. 74\u20138."},{"key":"10.1016\/j.microrel.2014.10.007_b0075","doi-asserted-by":"crossref","unstructured":"Kawamoto S, Yoshida M, Teraki S, Iida H. Effect of NCF design for the assembly of flip chip and reliability. In: Electronic components and technology conference (ECTC); 2012. p. 399\u2013405.","DOI":"10.1109\/ECTC.2012.6248861"},{"key":"10.1016\/j.microrel.2014.10.007_b0080","doi-asserted-by":"crossref","first-page":"1501","DOI":"10.1007\/s11664-007-0254-x","article-title":"Effects of minor additions of Zn on interfacial reactions of Sn\u2013Ag\u2013Cu and Sn\u2013Cu solders with various Cu substrates during thermal aging","volume":"36","author":"Cho","year":"2007","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2014.10.007_b0085","doi-asserted-by":"crossref","first-page":"2598","DOI":"10.1007\/s11664-010-1344-8","article-title":"Effects of Zn-containing flux on Sn\u20133.5Ag soldering with an electroless Ni\u2013P\/Au surface finish: microstructure and wettability","volume":"39","author":"Sakurai","year":"2010","journal-title":"J Electron Mater"},{"key":"10.1016\/j.microrel.2014.10.007_b0090","doi-asserted-by":"crossref","first-page":"11","DOI":"10.1016\/j.intermet.2012.03.046","article-title":"Suppressing the growth of Cu\u2013Sn intermetallic compounds in Ni\/Sn\u2013Ag\u2013Cu\/Cu\u2013Zn solder joints during thermal aging","volume":"26","author":"Yu","year":"2012","journal-title":"Intermetallics"},{"key":"10.1016\/j.microrel.2014.10.007_b0095","doi-asserted-by":"crossref","first-page":"10","DOI":"10.1016\/j.jallcom.2013.03.083","article-title":"Wetting characteristics of Cu\u2013xZn layers for Sn\u20133.0Ag\u20130.5Cu solders","volume":"567","author":"Lee","year":"2013","journal-title":"J Alloys Comp"},{"key":"10.1016\/j.microrel.2014.10.007_b0100","doi-asserted-by":"crossref","first-page":"39","DOI":"10.1108\/13565369910268268","article-title":"Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future","volume":"16","author":"Gilleo","year":"1999","journal-title":"Microelectron Int"},{"key":"10.1016\/j.microrel.2014.10.007_b0105","doi-asserted-by":"crossref","unstructured":"Kim S-H, Choi Y, Kim Y, Paik K-W. Flux function added solder anisotropic conductive films (ACFs) for high power and fine pitch assemblies. In: Electronic components and technology conference (ECTC), 2013 IEEE 63rd, IEEE2013. p. 1713\u20136.","DOI":"10.1109\/ECTC.2013.6575805"},{"key":"10.1016\/j.microrel.2014.10.007_b0110","doi-asserted-by":"crossref","first-page":"193","DOI":"10.1007\/BF03027277","article-title":"Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn\u20133.5Ag eutectic solder and copper substrate","volume":"9","author":"Yoon","year":"2003","journal-title":"Met Mater Int"}],"container-title":["Microelectronics Reliability"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271414004491?httpAccept=text\/xml","content-type":"text\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/api.elsevier.com\/content\/article\/PII:S0026271414004491?httpAccept=text\/plain","content-type":"text\/plain","content-version":"vor","intended-application":"text-mining"}],"deposited":{"date-parts":[[2025,5,13]],"date-time":"2025-05-13T22:38:32Z","timestamp":1747175912000},"score":1,"resource":{"primary":{"URL":"https:\/\/linkinghub.elsevier.com\/retrieve\/pii\/S0026271414004491"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,2]]},"references-count":22,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2015,2]]}},"alternative-id":["S0026271414004491"],"URL":"https:\/\/doi.org\/10.1016\/j.microrel.2014.10.007","relation":{},"ISSN":["0026-2714"],"issn-type":[{"value":"0026-2714","type":"print"}],"subject":[],"published":{"date-parts":[[2015,2]]},"assertion":[{"value":"Elsevier","name":"publisher","label":"This article is maintained by"},{"value":"Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40\u03bcm pitch Cu-pillar\/Sn\u2013Ag bump interconnection","name":"articletitle","label":"Article Title"},{"value":"Microelectronics Reliability","name":"journaltitle","label":"Journal Title"},{"value":"https:\/\/doi.org\/10.1016\/j.microrel.2014.10.007","name":"articlelink","label":"CrossRef DOI link to publisher maintained version"},{"value":"article","name":"content_type","label":"Content Type"},{"value":"Copyright \u00a9 2014 Elsevier Ltd. All rights reserved.","name":"copyright","label":"Copyright"}]}}